Application Introduction:
The exposed luminous characters are divided into monochrome, colorful and full-color luminous characters according to their colors. It is composed of a single color word light and a single color word light. The colorful exposed luminous characters are composed of a perforated word shell, a colorful external leakage lamp and a colorful controller. After the lamp is turned on, the colorful gradient can be realized. The full-color exposed luminous words are composed of a perforated word shell, a full-color external leakage lamp and a full-color controller. The program files are made by professional software and placed into the SD card. The SD card is inserted into the full-color controller. After the light is turned on, the external leakage luminous words can play flash animation and character animation, and the effect grade is very high.
High voltage 18v 30ma smd led chip rgb red green blue pink for exhibition light sign light
Quick details:
| Input Voltage(V): | 18-20V |
| Warranty(Year): | 2-Year |
| Type: | Smd Led Chip 2835 |
| Lighting solutions service: | Lighting and circuitry design |
| Luminous Efficacy(lm/w): | 29-32lm |
| Lifespan (hours): | 50000 |
| Working Time (hours): | 20000 |
| Chip Material: | INGAN |
| Emitting Color: | Red green blue |
| Power: | 0.2W |
| Viewing Angle(°): | 120 Degree |
| Color Rendering Index(Ra): | 80 |
| Packing bag: | 220*240nm |
| Place of Origin: | Suzhou ,jiangsu |
| Application: | Exhibition ,sign lights |
| Package Type: | Suface Mount Package |
| Forward Current: | 30MA |
| Size: | 2.8*3.5*0.65mm |
| Packing: | 4000 Pcs/Roll |
Product specification:
Outline Dimension:
Absolute Maximum Ratings:
| Item | Symbol | Maximum | Unit |
| Power dissipation | PD | 1 | W |
| Continuous forward current | IFmax | 60 | mA |
| Peak forward current (1/10 duty cycle 10ms pulse width) | IFP | 80 | mA |
| Reverse voltage | VR | 5 | V |
| Electrostatic Discharge (HBM) | ESD | 2000 | V |
| Operating temperature range | Topr | -40 to +85 | ℃ |
| Storage temperature range | Tstg | -40 to +85 | ℃ |
| Led yunction temperature | Tj | 125 | ℃ |
Electrical/Optical Characteristics:
| Item | Symbol | Condition | Color | Min | Typ | Max | Unit |
| Forward voltage | VF | IF=60mA | R | 17.5 | 18.5 | 19 | V |
| G | 17.5 | 18.5 | 19 | V |
| B | 17.5 | 18.5 | 19 | V |
| Viewing Angle | 2θ1/2 | IF=60mA | R/G/B | - | 120 | - | Deg |
| Luminous Intensity | IV | I IF=60mA | R | | - | | LM |
| G | | - | | LM |
| B | | - | | LM |
| Wavelength | WLD | IF=60mA | R | 615 | - | 620 | nm |
| G | 515 | - | 520 | nm |
| B | 452 | - | 457.5 | nm |
| Reverse Current | Ir | Vr=7V | R/G/B | 0 | | 1 | uA |
| Thermal resistance | Rth(j-s) | IF=60mA | R/G/B | | 28 | | ℃/W |
Typical Electro-Optical Characteristic Curves:
Reliability Test Items And Conditions:
| No. | Item | Test Conditions | Test hr/cycle/time | Sample Q’ty | Ac∕Re |
| 1 | Solder Heat | TEMP:260℃±5℃；5±1 sec | 2 times | 30 pcs | 0∕1 |
| 2 | Solder ability Test ※ | TEMP:235℃±5℃；3±1 sec | 1 time | 5 pcs | 0∕1 |
| 3 | Temperature Cycle | H:+100℃ 30min. ∫5min. L:-40℃ 30min. | 100 cycles | 20 pcs | 0∕1 |
| 4 | Thermal Shock | H:+100℃ 5min. ∫ L:-40℃ 5min. | 50 cycles | 20 pcs | 0∕1 |
| 5 | High Temperature Storage | TEMP:100℃ | 1000 hrs | 20 pcs | 0∕1 |
| 6 | Low Temperature Storage | TEMP:-40℃ | 1000 hrs | 20 pcs | 0∕1 |
| 7 | DC Operating Life | IF＝IFmax | 1000 hrs | 20 pcs | 0∕1 |
| 8 | High Temperature High Humidity | 85℃∕85％R.H. | 1000 hrs | 20 pcs | 0∕1 |
| 9 | Shocking test | 100～2000Hz ；98.1m/s2 X,Y,Z direction | 2 hrs | 20 pcs | 0∕1 |
| 10 | Dropping test | Put on pallet ；height:75cm | 3 times | 20 pcs | 0∕1 |
| Judgment Criteria |
| Forward Voltage VF | VF Max-Increase < 1.1x |
| Reverse Current IR | IR Max-Increase < IRmax |
| Luminous Intensity IV | IV Decay < 40% |
| ※Solder ability test criteria:coverage is not less than 95% Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours) |
Packing and Shipping Instruction:
Cautions:
The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.
Soldering iron :
When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds
The hand solder should be done only one times
SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following
Product features:
Adopt good quality chip and frame ,antistatic good stability Ultra low attenuation
High brightness ,low attenuation high color rendering
Minimum 70,80,90 95 CRI options
Strong welding and good stability undead light
Product series and company logo on the front
CE ROHS LM80 Certification
Production Process:
Product Tags:
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LM80 18v 30ma 2835 LED Chip Red Pink For Grow Light Images
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